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C9530
Document #: 38-07033 Rev. *C
Page 10 of 11
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Diagrams
All product and company names mentioned in this document may be the trademarks of their respective holders.
48-lead Shrunk Small Outline Package O48
51-85061-*C
1.100[0.043]
0.051[0.002]
0.851[0.033]
SEATING
PLANE
1
24
0.508[0.020]
0.500[0.019]
7.950[0.313]
0.25[0.010]
6.198[0.244]
12.395[0.488]
8.255[0.325]
5.994[0.236]
0.950[0.037]
0.500[0.020]
BSC
12.598[0.496]
0.152[0.006]
0.762[0.030]
0°-8°
DIMENSIONS IN MM[INCHES] MIN.
MAX.
MAX.
0.170[0.006]
0.279[0.011]
GAUGE PLANE
0.20[0.008]
25
48
0.100[0.003]
0.200[0.008]
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.33gms
PART #
Z4824 STANDARD PKG.
ZZ4824 LEAD FREE PKG.
48-lead (240-mil) TSSOP II Z4824
51-85059-*C
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