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TE28F320C3BC70 Datasheet(PDF) 1 Page - Intel Corporation |
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TE28F320C3BC70 Datasheet(HTML) 1 Page - Intel Corporation |
1 / 68 page Intel£ Advanced+ Boot Block Flash Memory (C3) 28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16) Datasheet Product Features The Intel ® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest 0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase) with high- speed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel ® Flash Data Integrator (FDI) software and you have a cost- effective, flexible, monolithic code plus data storage solution. Intel ® Advanced+ Boot Block Flash Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be obtained by accessing the Intel ® Flash website: http://www.intel.com/design/flash. ■ Flexible SmartVoltage Technology — 2.7 V– 3.6 V Read/Program/Erase — 12 V for Fast Production Programming ■ 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option — Reduces Overall System Power ■ High Performance — 2.7 V– 3.6 V: 70 ns Max Access Time ■ Optimized Architecture for Code Plus Data Storage — Eight 4 Kword Blocks, Top or Bottom Parameter Boot — Up to One Hundred-Twenty-Seven 32 Kword Blocks — Fast Program Suspend Capability — Fast Erase Suspend Capability ■ Flexible Block Locking — Lock/Unlock Any Block — Full Protection on Power-Up — WP# Pin for Hardware Block Protection ■ Low Power Consumption — 9 mA Typical Read — 7 A Typical Standby with Automatic Power Savings Feature (APS) ■ Extended Temperature Operation —–40 °C to +85 °C ■ 128-bit Protection Register — 64 bit Unique Device Identifier — 64 bit User Programmable OTP Cells ■ Extended Cycling Capability — Minimum 100,000 Block Erase Cycles ■ Software —Intel ® Flash Data Integrator (FDI) — Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice) — Intel Basic Command Set — Common Flash Interface (CFI) ■ Standard Surface Mount Packaging — 48-Ball µBGA*/VFBGA — 64-Ball Easy BGA Packages — 48-Lead TSOP Package ■ ETOX™ VIII (0.13 µm) Flash Technology — 16, 32 Mbit ■ ETOX™ VII (0.18 µm) Flash Technology — 16, 32, 64 Mbit ■ ETOX™ VI (0.25 µm) Flash Technology — 8, 16 and 32 Mbit Order Number: 290645-017 October 2003 Notice: This specification is subject to change without notice. Verify with your local Intel sales office that you have the latest datasheet before finalizing a design. |
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