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L6374 Datasheet(PDF) 4 Page - STMicroelectronics

Part No. L6374
Description  INDUSTRIAL QUAD LINE DRIVER
Download  13 Pages
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Maker  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
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L6374 Datasheet(HTML) 4 Page - STMicroelectronics

 
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THERMAL CHARACTERISTICS
Rth j-pins
POWERDIP. The thermal resistance is referred
to the thermal path from the dissipating region
on the top surface of the silicon chip, to the
points along the four central pins of the pack-
age, at a distance of 1.5 mm away from the
stand-offs.
SO. Similarly, the reference point is the knee
on the four central pins, where the pins are up-
wardly bent and the soldering joint with the
PCB footprint can be made.
Rth j-amb1
If a dissipating surface, thick at least 35
µm,
and with a surface similar or bigger than the
one shown, is created making use of the
printed circuit.
Such heatsinking surface is considered on the
bottom side of an horizontal PCB (worst case).
Rth j-amb2
If the power dissipating pins (the four central
ones), as well as the others, have a minimum
thermal connection with the external world
(very thin strips only) so that the dissipation
takes place through still air and through the
PCB itself.
It is the same situation of point above, without
any heatsinking surface created on purpose on
the board.
Additional data for the PowerDip package can be
found in:
Application Note 9030:
Thermal Characteristics of the PowerDip
20,24 Packages Soldered on 1,2,3 oz.
Copper PCB
THERMAL DATA
Symbol
Parameter
DIP20
SO20
Unit
Rth j-pin
Thermal Resistance, Junction to Pin
12
17
°C/W
Rth j-amb1
Thermal Resistance, Junction to Ambient (see Thermal
Characteristics)
40
65
°C/W
Rth j-amb2
Thermal Resistance, Junction to Ambient (see Thermal
Characteristics)
50
80
°C/W
Figure 1: Printed Heatsink
L6374
4/13


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