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ADC081500 Datasheet(PDF) 11 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # ADC081500
Description  High Performance, Low Power, 8-Bit, 1.5 GSPS A/D Converter
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

ADC081500 Datasheet(HTML) 11 Page - National Semiconductor (TI)

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Converter Electrical Characteristics (Continued)
The following specifications apply after calibration for V
A =VDR = +1.9VDC, OutV = 1.9V, VIN (a.c. coupled) Full Scale Range =
differential 870mV
P-P,CL = 10 pF, Differential (a.c. coupled) sinewave input clock, fCLK = 1.5 GHz at 0.5VP-P with 50% duty
cycle, V
BG = Floating, Normal Control Mode, Single Data Rate Mode, REXT = 3300
±0.1%, Analog Signal Source Impedance
= 100
Ω Differential. Boldface limits apply for T
A =TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6,
7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
AC ELECTRICAL CHARACTERISTICS
t
CalDly
Calibration delay determined by
pin 127
See Section 1.1.1, Figure 9,
(Note 11)
2
25
Clock Cycles
(min)
t
CalDly
Calibration delay determined by
pin 127
See Section 1.1.1, Figure 9,
(Note 11)
2
31
Clock Cycles
(max)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no guarantee of operation at the Absolute Maximum
Ratings. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and
test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supply limits (that is, less than GND or greater than VA), the current at that pin should be limited to
25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two.
This limit is not placed upon the power, ground and digital output pins.
Note 4: Human body model is 100 pF capacitor discharged through a 1.5 k
Ω resistor. Machine model is 220 pF discharged through ZERO Ohms.
Note 5: See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability”.
Note 6: The analog inputs are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device.
20153104
Note 7: To guarantee accuracy, it is required that VA and VDR be well bypassed. Each supply pin must be decoupled with separate bypass capacitors. Additionally,
achieving rated performance requires that the backside exposed pad be well grounded.
Note 8: Typical figures are at TA = 25˚C, and represent most likely parametric norms. Test limits are guaranteed to National’s AOQL (Average Outgoing Quality
Level).
Note 9: Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for this device,
therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Figure 2. For relationship between Gain Error and Full-Scale Error, see Specification
Definitions for Gain Error.
Note 10: The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF each pin to ground
are isolated from the die capacitances by lead and bond wire inductances.
Note 11: This parameter is guaranteed by design and is not tested in production.
Note 12: This parameter is guaranteed by design and/or characterization and is not tested in production.
Note 13: The digital control pin capacitances are die capacitances only. Additional package capacitance of 1.6 pF each pin to ground are isolated from the die
capacitances by lead and bond wire inductances.
Note 14: The ADC081500 converter has two LVDS output buses, which each clock data out at one half the sample rate. The second bus (D0 through D7) has a
pipeline latency that is one Input Clock cycle less than the latency of the first bus (Dd0 through Dd7).
Note 15: Tying VBG to the supply rail will increase the output offset voltage (VOS) by 400mv (typical), as shown in the VOS specification above. Tying VBG to the
supply rail will also affect the differential LVDS output voltage (VOD), causing it to increase by 40mV (typical).
www.national.com
11


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