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ADCMP604BKSZ-RL Datasheet(PDF) 7 Page - Analog Devices |
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ADCMP604BKSZ-RL Datasheet(HTML) 7 Page - Analog Devices |
7 / 16 page ADCMP604/ADCMP605 Rev. A | Page 7 of 16 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADCMP604 TOP VIEW (Not to Scale) Q 1 Q 6 VEE 2 VCCI/VCCO 5 VP 3 VN 4 Figure 3. ADCMP604 Pin Configuration Table 5. ADCMP604 Pin Function Descriptions (6-Lead SC70) Pin No. Mnemonic Description 1 Q Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN. 2 VEE Negative Supply Voltage. 3 VP Noninverting Analog Input. 4 VN Inverting Analog Input. 5 VCCI/VCCO Input Section Supply/Output Section Supply. VCCI and VCCO are shared pin. 6 Q Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN. PIN 1 INDICATOR TOP VIEW (Not to Scale) ADCMP605 VCCO 1 VCCI 2 VEE 3 9 VEE 8 LE/HYS 7 SDN Figure 4. ADCMP605 Pin Configuration Table 6. ADCMP605 Pin Function Descriptions (12-Lead LFCSP_VQ) Pin No. Mnemonic Description 1 VCCO Output Section Supply. 2 VCCI Input Section Supply. 3, 5, 9, 11 VEE Negative Supply Voltages. 4 VP Noninverting Analog Input. 6 VN Inverting Analog Input. 7 SDN Shutdown. Drive this pin low to shut down the device. 8 LE/HYS Latch/Hysteresis Control. Bias with resistor or current for hysteresis; drive low to latch. 10 Q Inverting Output. Q is at Logic low if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN, if the comparator is in compare mode. 12 Q Noninverting Output. Q is at Logic high if the analog voltage at the noninverting input, VP, is greater than the analog voltage at the inverting input, VN, if the comparator is in compare mode. Heat Sink Paddle VEE The metallic back surface of the package is electrically connected to VEE. It can be left floating because Pin 3, Pin 5, Pin 9, and Pin 11 provide adequate electrical connection. It can also be soldered to the application board if improved thermal and/or mechanical stability is desired. |
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