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FMS2016-005 Datasheet(PDF) 5 Page - Filtronic Compound Semiconductors |
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FMS2016-005 Datasheet(HTML) 5 Page - Filtronic Compound Semiconductors |
5 / 6 page 5 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filtronic.com Datasheet v3.0 FMS2016-005 QFN 12 LEAD 3*3 PACKAGE OUTLINE: Note: PIN1 Identifier is at ground potential • NiPdAu finish for Military and High reliability applications TAPE & REEL SPECIFICATION: TAPE DIMENSIONS DESCRIPTION SYMBOL SIZE (MM) Perforation Diameter D0 1.5 ±0.1 Pitch P0 4.0 ±0.1 Position E1 1.75 ±0.1 Cavity Length A0 3.3 ±0.1 Width B0 3.3 ±0.1 Depth K 1.1 ±0.1 Cavity to Perforation (length direction) P2 2.0 ±0.1 Distance between centrelines Cavity to Perforation (width direction) F 5.5 ±0.1 Carrier tape Width W 12 ±0.3 |
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