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FMS2029-000-WP Datasheet(PDF) 2 Page - Filtronic Compound Semiconductors |
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FMS2029-000-WP Datasheet(HTML) 2 Page - Filtronic Compound Semiconductors |
2 / 5 page Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filtronic.com 2 Pre-Production Datasheet v3.0 FMS2029 ABSOLUTE MAXIMUM RATINGS: Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the device. PAD LAYOUT: TRUTH TABLE: Note: -5V ± 0.2V; 0V ± 0.2V Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of bond pad opening PARAMETER SYMBOL ABSOLUTE MAXIMUM Max Input Power Pin +27dBm Operating Temp Toper -40°C to +85°C Storage Temp Tstor -55°C to +150°C PAD NAME DESCRIPTION PIN COORDINATES (µm) RFIN RFIN 141,587 RFO RFOUT 1789,587 V1 V1 901,161 V2 V2 1101,161 CONTROL LINE RF PATH V1 V2 RFIN-RFO -5V 0V On (Low Loss) 0V -5V Off (Isolation) DIE SIZE ( µm) DIE THICKNESS ( µm) MIN. BOND PAD PITCH ( µm) MIN. BOND PAD OPENING ( µm x µm ) 1910 x 1110 100 150 116 x 116 |
Similar Part No. - FMS2029-000-WP |
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Similar Description - FMS2029-000-WP |
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