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Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is 38MPA0725)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.241 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd1)

Bond Pad #3 (Vd2)

Bond Pad #4 (Vd3)

Bond Pad #5 (Vd4)

Bond Pad #6 (RF Out)

Bond Pad #7 (Vg4)

Bond Pad #8 (Vg3)

Bond Pad #9 (Vg2)

Bond Pad #10 (Vg1)

37.0-42.0 GHz GaAs MMIC

Power Amplifier

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2007 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

February 2007 - Rev 01-Feb-07

P1018-BD

1.700

(0.067)

1

2

3

4

5

6

7

8

9

10

0.592

(0.023)

0.992

(0.039)

1.392

(0.055)

2.193

(0.086)

1.993

(0.078)

1.392

(0.055)

0.992

(0.039)

0.592

(0.023)

0.0

0.0

1.099

(0.043)

0.639

(0.025)

2.500

(0.098)

1

2

3

4

5

6

7

8

9

10

RF In

Vg1

RF Out

Vg2

Vd1

Vd2

Vd3

Vd4

Vg3

Vg4