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XP1015-BD Datasheet(PDF) 3 Page - Mimix Broadband

Part No. XP1015-BD
Description  43.5-46.5 GHz GaAs MMIC Power Amplifier
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Maker  MIMIX [Mimix Broadband]
Homepage  http://www.mimixbroadband.com
Logo MIMIX - Mimix Broadband

XP1015-BD Datasheet(HTML) 3 Page - Mimix Broadband

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Mechanical Drawing
Bias Arrangement
Bypass Capacitors - See App Note [2]
(Note: Engineering designator is 44MPA0475)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 13.349 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
43.5-46.5 GHz GaAs MMIC
Power Amplifier
4.630
(0.182)
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2
3
4
5
6
7
8
9
10
11
12
13
1.226
(0.048)
1.725
(0.068)
2.225
(0.088)
2.625
(0.103)
3.827
(0.151)
3.225
(0.127)
2.625
(0.103)
2.225
(0.088)
1.725
(0.068)
1.226
(0.048)
0.0
0.0
2.620
(0.103)
14
3.225
(0.127)
3.827
(0.151)
2.006
(0.079)
4.650
(0.183)
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2
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RF In
RF Out
Vg3
Vg2
Vg1
Vd3
Vd2
Vd1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
August 2007 - Rev 10-Aug-07
P1015-BD


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