EVB72006

315MHz FSK/ASK Transmitter

Evaluation Board Description

39012 72006 01

Page 10 of 12

EVB Description

Rev. 004

Dec/07

6

Package Description

The device TH72006 is RoHS compliant.

Fig. 7:

10L QFN 3x3 Dual

all Dimensions in mm

D

E

D2

E2

A

A1

A3

L

e

b

min

2.85

2.85

2.23

1.49

0.80

0

0.3

0.18

max 3.15

3.15

2.48

1.74

1.00

0.05

0.20

0.5

0.50

0.30

all Dimensions in inch

min 0.112 0.112 0.0878 0.051 0.0315

0

0.0118

0.0071

max 0.124 0.124 0.0976 0.055 0.0393 0.002

0.0079

0.0197

0.0197

0.0118

6.1

Soldering Information

•

The device TH72006 is qualified for MSL3 with soldering peak temperature 260 deg C

according to JEDEC J-STD-20

6.2

Recommended PCB Footprints

all Dimensions in mm

Z

G

X

Y

e

min

3.55

1.9

3.2

1.3

0.25

0.7

0.3

max

3.90

2.3

3.6

1.7

0.30

1.0

0.5

0.5

all Dimensions in inch

min 0.1398 0.0748 0.1260 0.0512 0.0098 0.0276 0.0591

max 0.1535 0.0906 0.1417 0.0669 0.0118 0.0394 0.0197

0.0197

Fig. 8:

PCB land pattern style

solder stop

solder pad

e

X

Y

Z G

15

6

10

A

A1

A3

D

E

1

5

6

10

e

b

E2

D2

L

0.36

0.225x45°

0.23

ex pos ed pad

The “exposed pad” is not connected

to internal ground,

it should not be connected to the PCB.