SGM8067

3

PACKAGE/ORDERING INFORMATION

MODEL

ORDER

NUMBER

PACKAGE

DESCRIPTION

PACKAGE

OPTION

MARKING

INFORMATION

SGM8067

SGM8067XS/TR

SO-8

Tape and Reel

SGM8067XS

ABSOLUTE MAXIMUM RATINGS

Supply Voltage, V+ to V- . . . . . . . . . . . . . . . . . . . . . 7.5 V

Internal Power Dissipation

SO-8 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 W

Common-Mode Input Voltage

Storage Temperature Range . . . . . . . . .–65℃ to +150℃

Junction Temperature . . . . . . . . . . . . . . . .. . . . . . . .160℃

Operating Temperature Range . . . . . . –55℃ to +150℃

Lead Temperature Range (Soldering 10 sec)

. . . . . . . . . . .. . . . . . . . . . . . . . . . 260℃

NOTES

1. Stresses above those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This is

a stress rating only; functional operation of the device at

these or any other conditions above those indicated in the

operational section of this specification is not implied.

Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

CAUTION

This integrated circuit can be damaged by ESD. Sheng

Bang

Micro

Electronics

recommends

that

all

integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance

degradation to complete device failure. Precision

integrated circuits may be more susceptible to

damage because very small parametric changes could

cause

the

device

not

to

meet

its

published

specifications.