74LVTH32245_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 23 January 2008

10 of 13

NXP Semiconductors

74LVTH32245

3.3 V 32-bit bus transceiver; 3-state

12. Package outline

Fig 8.

Package outline SOT536-1 (LFBGA96)

0.8

b

UNIT

D

y

e

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

00-03-04

03-02-05

IEC

JEDEC

JEITA

mm

1.5

0.41

0.31

1.2

0.9

5.6

5.4

13.6

13.4

0.51

0.41

0.1

0.2

4

12

DIMENSIONS (mm are the original dimensions)

SOT536-1

E

0.15

v

0.1

w

0

5

10 mm

scale

SOT536-1

LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm

A

max.

A

detail X

e

e

X

D

E

A

B

C

D

E

F

H

G

J

K

L

M

P

N

R

T

246

135

B

A

e2

e1

ball A1

index area

ball A1

index area

y

y1 C

b

C

A

C

C

B

1/2

e

1/2

e