1

FEATURES

DBV, DCK, OR DRL PACKAGE

(TOP VIEW)

1

2

3

6

5

4

GND

A

OE

B

YZP PACKAGE

(BOTTOM VIEW)

GND

A

B

2

3

6

4

1

5

OE

abc

DESCRIPTION/ORDERING INFORMATION

TXS0101

1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR

FOR OPEN-DRAIN APPLICATIONS

SCES638 – OCTOBER 2007

www.ti.com

2

• Available in the Texas Instruments NanoFree™

Package

• 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on

• V

GND, Both Ports Are in the High-Impedance

State

• I

Operation

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD 22

–

A Port

–

2500-V Human-Body Model (A114-B)

abc

–

200-V Machine Model (A115-A)

abc

–

1500-V Charged-Device Model (C101)

abc

–

B Port

abc

–

8-kV Human-Body Model (A114-B)

–

200-V Machine Model (A115-A)

–

1500-V Charged-Device Model (C101)

This one-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to

low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a

pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Reel of 3000

TXS0101YZPR

_ _ _2G_

(Pb-free)

Reel of 3000

TXS0101DBVR

SOT (SOT-23) – DBV

2G_

Reel of 250

TXS0101DBVT

–40

°C to 85°C

Reel of 3000

TXS0101DCKR

SOT (SC-70) – DCK

NFF_

Reel of 250

TXS0101DCKT

Reel of 3000

TXS0101DRLR

SOT (SOT-563) – DRL

2G_

Reel of 250

TXS0101DRLT

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.