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BPD-HQA33-TRB Datasheet(PDF) 5 Page - BRIGHT LED ELECTRONICS CORP |
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BPD-HQA33-TRB Datasheet(HTML) 5 Page - BRIGHT LED ELECTRONICS CORP |
5 / 6 page B BR RIIG GH HT T L LE ED D E EL LE EC CT TR RO ON NIIC CS S C CO OR RP P.. B BP PD D--H HQ QA A3 33 3--T TR RB B SINCE 1981 ● Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 235℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). ● Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Time OVER 2 MIN. 4℃ /SEC. MAX. 4℃ /SEC. MAX. 10 SEC. MAX. 235℃ MAX. 140~160℃ Time 120~180 sec. Preheat 245 ±5℃ within 5 sec. Soldering heat Max. 260 ℃ 120~150℃ Ver.1.1 Page 5 of 6 |
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