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BL-XG0361-TR9 Datasheet(PDF) 5 Page - BRIGHT LED ELECTRONICS CORP

Part No. BL-XG0361-TR9
Description  AXIAL TYPE LED LAMPS SPECIFICATION
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Maker  BRIGHT [BRIGHT LED ELECTRONICS CORP]
Homepage  http://www.brightled.co.kr
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BL-XG0361-TR9 Datasheet(HTML) 5 Page - BRIGHT LED ELECTRONICS CORP

   
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BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
PAGE:
6
REVISION:
1.0
1.
SOLDERING:
● Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
● Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 235℃(MAX.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
● DIP soldering (Wave Soldering)
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
2.
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
TIME
OVER 2 MIN.
4
℃ /SEC. MAX.
4
℃ /SEC. MAX.
10 SEC. MAX.
235
℃ MAX.
140~160
TIME
120~180 sec.
Preheat
245
±5℃ within 5 sec.
Soldering heat Max. 260
120~150


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