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BAT60J Datasheet(PDF) 4 Page - STMicroelectronics

Part No. BAT60J
Description  SMALL SIGNAL SCHOTTKY DIODE
Download  5 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

BAT60J Datasheet(HTML) 4 Page - STMicroelectronics

  BAT60J Datasheet HTML 1Page - STMicroelectronics BAT60J Datasheet HTML 2Page - STMicroelectronics BAT60J Datasheet HTML 3Page - STMicroelectronics BAT60J Datasheet HTML 4Page - STMicroelectronics BAT60J Datasheet HTML 5Page - STMicroelectronics  
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BAT60J
4/5
0
25
50
75
100
125
150
1E-1
1E+0
1E+1
1E+2
1E+3
1E+4
1E+5
Tj(
°C)
IR[Tj] / IR[Tj=25
°C]
VR=8V
Fig. 6: Reverse leackage current versus junction
temperature (typical values).
110
10
100
VR(V)
C(pF)
F=1MHz
Tj=25
°C
Fig. 7: Junction capacitance versus reverse voltage
applied (typical values).
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1E-1
1E+0
1E+1
VFM(V)
IFM(A)
Tj=150
°C
(Typical values)
Tj=80
°C
(Typical values)
Tj=25
°C
(Maximum values)
Fig. 8-1: Forward voltage drop versus forward cur-
rent (High level).
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VFM(V)
IFM(A)
Tj=150
°C
(Typical values)
Tj=25
°C
(Maximumvalues)
Tj=80
°C
(Typical values)
Fig. 8-2: Forward voltage drop versus forward cur-
rent (Low level).
0
1020
304050
607080
90
100
100
150
200
250
300
350
400
450
500
550
600
S(Cu) (mm )
Rth(j-a) (
°C/W)
IF=0.75A
Fig. 9: Thermal resistance junction to ambient ver-
sus copper surface (epoxy printed circuit board FR4,
copper thickness: 35
µm).


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