3

3 - 6

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Pad Number

Function

Description

Interface Schematic

1RF

This pin is AC coupled

and matched to 50 Ohm.

2LO

This pin is AC coupled

and matched to 50 Ohm.

3, 4

IF1, IF2

This pin is DC coupled. For operation to

DC pin must not sink/source more than

2 mA of current or failure may result.

Backside

GND

The backside of the die must connect to RF ground.

Pad Descriptions

HMC256

v03.1007

GaAs MMIC I/Q MIXER

5.9 - 12 GHz