TOP250F datasheet(33/52 Pages) POWERINT

Part #	TOP250F

Description	TOPSwitch-GX Family Extended Power, Design Flexible, EcoSmart, Integrated Off-line Switcher

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Manufacturer	POWERINT [Power Integrations, Inc.]

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TOP242-250

33

M

12/04

Parameter

Symbol

Conditions

SOURCE = 0 V; T

J = -40 to 125 °C

See Figure 53

(Unless Otherwise Speciﬁed)

Min

Typ

Max

Units

CONTROL FUNCTIONS

Switching

Frequency

(average)

f

OSC

I

C = 3 mA;

T

J = 25 °C

FREQUENCY Pin

Connected to SOURCE

124

132

140

kHz

FREQUENCY Pin

Connected to CONTROL

61.5

66

70.5

Duty Cycle at

ONSET of

Frequency

Reduction

DC

(ONSET)

10

%

Switching

Frequency near

0% Duty Cycle

f

OSC(DMIN)

132 kHz Operation

30

kHz

66 kHz Operation

15

Frequency Jitter

Deviation

∆

f

132 kHz Operation

±4

kHz

66 kHz Operation

±2

Frequency Jitter

Modulation Rate

f

M

250

Hz

ABSOLUTE MAXIMUM RATINGS(1)

DRAIN Voltage ..................................................-0.3Vto700V

DRAIN Peak Current: TOP242......................................0.72 A

TOP243.......................................1.44 A

TOP244..........................................2.16A

TOP245.......................................2.88 A

TOP246..........................................4.32 A

TOP247..........................................5.76 A

TOP248..........................................7.20 A

TOP249..........................................8.64 A

TOP250........................................10.08A

CONTROLVoltage ................................................ -0.3Vto 9V

CONTROL Current .................................................... 100 mA

LINE SENSE Pin Voltage ...................................-0.3 V to 9 V

CURRENT LIMIT Pin Voltage ........................-0.3 V to 4.5 V

MULTI-FUNCTION Pin Voltage ........................-0.3 V to 9 V

FREQUENCY Pin Voltage ..................................-0.3 V to 9 V

Storage Temperature ..................................... -65 °C to 150 °C

Operating Junction Temperature(2) ................ -40 °C to 150 °C

Lead Temperature(3) ...................................................... 260 °C

Notes:

1. All voltages referenced to SOURCE, T

A = 25 °C.

2. Normally limited by internal circuitry.

3. 1/16 in. from case for 5 seconds.

THERMAL IMPEDANCE

Thermal Impedance: Y or F Package:

(θ

JA)

(1)

...............................................80 °C/W

(θ

JC)

(2)

.................................................2 °C/W

P or G Package:

(θ

JA) ............................ 70 °C/W

(3)

; 60 °C/W(4)

(θ

JC)

(5)

................................................ 11 °C/W

R Package:

(θ

JA) ..........80 °C/W

(7)

; 40 °C/W(4); 30 °C/W(6)

(θ

JC)

(5)

..................................................2 °C/W

Notes:

1. Free standing with no heatsink.

2. Measured at the back surface of tab.

3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2)

copper clad.

4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.

5. Measured on the SOURCE pin close to plastic interface.

6. Soldered to 3 sq. in. (1935 mm2), 2 oz. (610 g/m2) copper clad.

7. Soldered to foot print area, 2 oz. (610 g/m2) copper clad.

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TOP250F Datasheet(PDF) 33 Page - Power Integrations, Inc.

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