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OPA454 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA454 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 36 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) PIN ASSIGNMENTS 1 2 3 4 8 7 6 5 E/D(Enable/Disable) V+ OUT StatusFlag E/DCom(Enable/DisableCommon) -IN +IN V- PowerPAD HeatSink (Locatedon bottomside) (1) V- NC (3) NC (3) V- +IN NC (3) -IN NC (3) E/DCom(Enable/DisableCommon) V- V- NC (3) NC (3) StatusFlag V OUT V+ NC (3) NC (3) E/D(Enable/Disable) V- 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 PowerPAD HeatSink (Locatedon topside) (2) OPA454 SBOS391 – DECEMBER 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING OPA454 SO-8 DDA OPA454 OPA454 HSOP-20(2) DWD OPA454 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Available Q2, 2008. OPA454 UNIT Supply Voltage VS = (V+) – (V–) 120 V Signal Input Terminals, Voltage(2) (V–) – 0.3 to (V+) + 0.3 V Signal Input Terminals, Current(2) ±10 mA E/D to E/D Com Voltage +5.5 V Output Short-Circuit(3) ISC Continuous Operating Temperature TJ –55 to +125 °C Storage Temperature –55 to +125 °C Junction Temperature TJ +150 °C Human Body Model (HBM) 4000 V ESD Rating: Charged Device Model (CDM) 500 V Machine Model (MM) 150 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground. DDA PACKAGE DWD PACKAGE(1) SO-8 PowerPAD HSOP-20 PowerPAD (TOP VIEW) (TOP VIEW) (1) PowerPAD is internally connected to V–. Soldering the PowerPAD to the PCB is always required, even with applications that have low power dissipation. (1) Available Q2, 2008. (2) PowerPAD is internally connected to V–. (3) NC = No internal connection 2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): OPA454 |
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