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TLC070AIDG4 Datasheet(PDF) 24 Page - Texas Instruments |
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TLC070AIDG4 Datasheet(HTML) 24 Page - Texas Instruments |
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24 / 50 page  TLC070, TLC071, TLC072, TLC073, TLC074, TLC075, TLC07xA FAMILY OF WIDEBANDWIDTH HIGHOUTPUT DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS219E − JUNE 1999 − REVISED SEPTEMBER 2006 24 WWW.TI.COM POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 APPLICATION INFORMATION general PowerPAD design considerations (continued) TJ = 150°C 4 3 2 0 −55 −40 −10 20 35 5 6 MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 7 65 95 125 1 TA − Free-Air Temperature − °C DGN Package Low-K Test PCB θJA = 52.3°C/W SOT-23 Package Low-K Test PCB θJA = 324°C/W −25 5 50 80 110 PWP Package Low-K Test PCB θJA = 29.7°C/W SOIC Package Low-K Test PCB θJA = 176°C/W PDIP Package Low-K Test PCB θJA = 104°C/W NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 53. Maximum Power Dissipation vs Free-Air Temperature The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent power and output power. The designer should never forget about the quiescent heat generated within the device, especially multi-amplifier devices. Because these devices have linear output stages (Class A-B), most of the heat dissipation is at low output voltages with high output currents. The other key factor when dealing with power dissipation is how the devices are mounted on the PCB. The PowerPAD devices are extremely useful for heat dissipation. But, the device should always be soldered to a copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC package, on the other hand, is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around the device, θJA decreases and the heat dissipation capability increases. The currents and voltages shown in these graphs are for the total package. For the dual or quad amplifier packages, the sum of the RMS output currents and voltages should be used to choose the proper package. |
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