SFH 5440, SFH 5441

2007-09-18

7

Lötbedingungen

Vorbehandlung nach JEDEC Level 4

Soldering Conditions

Preconditioning acc. to JEDEC Level 4

Reflow Lötprofil für bleifreies Löten

(nach J-STD-020C)

Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020C)

Published by

OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

www.osram-os.com

© All Rights Reserved.

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components

to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

OHLA0687

0

0

T

t

˚C

s

120 s max

50

100

150

200

250

300

Ramp Up

100 s max

50

100

150

200

250

300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

+5 ˚C

Minimum Solder Profile

10 s min

min. condition for IR Reflow Soldering:

solder point temperature

≥ 235 °C for at least 10 sec.