7

CL330

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline

8-Lead SOIC (w/Heat Slug) Package Outline (SG)

4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch

Symbol

A

A1

A2

b

D

D1

E

E1

E2

e

h

L

L1

L2

θ

θ1

Dimension

(mm)

MIN

1.25

0.00

1.25

0.31

4.80

3.30*

5.80

3.80

2.29*

1.27

BSC

0.25

0.40

1.04

REF

0.25

BSC

NOM

----

4.90

-

6.00

3.90

-

-

-

-

-

MAX

1.70

0.15

1.70

0.51

5.00

3.81*

6.20

4.00

2.79*

0.50

1.27

JEDEC Registration MS-012, Variation BA, Issue E, Sept. 2005.

Dimensions marked with (*) are non-JEDEC dimensions.

Drawings not to scale.

D

Seating

Plane

Gauge

Plane

L

L1

L2

Top View

Side View

View A-A

View B

View

B

θ1

θ

E1

E

A A2

A1

A

A

Seating

Plane

e

b

h

h

8

1

D1

E2

Bottom View

Exposed

Thermal

Pad Zone

Note 1

Note 1

(Index Area

D/2 x E1/2)

8

1

Note 1:

This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either a

mold, or an embedded metal or marked feature.

Doc.# DSFP-CL330

NR110907