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STTH4R02D Datasheet(PDF) 11 Page - STMicroelectronics |
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STTH4R02D Datasheet(HTML) 11 Page - STMicroelectronics |
11 / 13 page STTH4R02 Package information 11/13 Figure 20. SMC footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 9. SMC dimensions Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 Table 10. DO-201AB Dimensions REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 8.5 9.5 0.335 0.374 B 25.4 1 Ø C 4.8 5.3 0.189 0.209 Ø D 0.96 1.06 0.038 0.042 E C L E2 E1 D A1 A2 b 4.25 8.65 2.20 3.30 2.20 ØC ØD A BB |
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