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LTC4221 Datasheet(PDF) 18 Page - Linear Technology

Part # LTC4221
Description  Dual Supply Hot Swap Controller for Advanced Mezzanine Card
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC4221 Datasheet(HTML) 18 Page - Linear Technology

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LTC4223-1/LTC4223-2
18
422312f
The first step is to select the appropriate value of RSENSE
for the 12V supply. Calculating RSENSE value is based on
the maximum load current and the lower limit for the
circuit breaker threshold, ΔVSENSE(CB)(MIN).
R
V
I
mV
SENSE
SENSE CB MIN
LOAD MAX
=
Δ
=
()(
)
()
.
.
47 5
74A
A
m
= 6 Ω
If a 1% tolerance is assumed for the 6mΩ sense resistor,
the minimum and maximum circuit breaker trip current is
calculated as follows:
422312 F11
C2
330nF
VCC
AUXIN
R2
51
Ω
Figure 11. RC Network for VCC Filtering
APPLICATIONS INFORMATION
PCB Layout Considerations
For proper operation of the LTC4223’s circuit breaker,
Kelvin-connection to the sense resistor is strongly rec-
ommended. The PCB layout should be balanced and
symmetrical to minimize wiring errors. In addition, the
PCB layout for the sense resistor and the power MOSFET
should include good thermal management techniques for
optimal device power dissipation. A recommended PCB
layout for the 12V sense resistor and the power MOSFET
is illustrated in Figure 12.
In applications where load current exceeds 10A, wide
PCB traces are recommended to minimize resistance
and temperature rise. The suggested trace width for 1
oz copper foil is 0.03” for each ampere of DC current to
keep PCB trace resistance, voltage drop and temperature
rise to a minimum. Note that the sheet resistance of 1 oz
copper foil is approximately 0.5mΩ/square, and voltage
drops due to trace resistance add up quickly in high cur-
rent applications.
In most applications, it will be necessary to use plated-
through via to make circuit connections from component
layers to power and ground layers internal to the PCB. For
1 oz copper foil plating, a general rule is 1A of DC current
per via. Consult your PCB fabrication facility for design
rules pertaining to other plating thicknesses.
It is important to place the VCC bypass capacitor C2 as
close as possible between VCC and GND. The transient
voltage suppressors Z1 and Z2 are also placed between
the supply inputs and ground using short wide traces.
Design Example
As a design example, consider the AMC Hot Swap ap-
plication shown earlier in Figure 1 with the power supply
requirements given in Table 2.
CURRENT FLOW
TO LOAD
TRACK WIDTH W:
0.03" PER AMPERE
ON 1OZ Cu FOIL
SENSE
RESISTOR
POWER PAK
SO-8
12VOUT
12VIN
GND
422312 F12
GND
CG
12VGATE
VIA TO
GND PLANE
16
1
2
15
LTC4223CGN*
CURRENT FLOW
TO LOAD
W
CURRENT FLOW
TO SOURCE
*ADDITIONAL DETAILS OMITTED FOR CLARITY, DRAWING NOT TO SCALE!
VIA TO
GND PLANE
W
W
RG
R3
R1
Z1
C1
8
Figure 12. Recommended Layout for Power MOSFET, Sense
Resistor and GATE Components on 12V Rail
Table 2. AMC Power Supply Requirements
SUPPLY VOLTAGE
MAXIMUM LOAD
CURRENT
MAXIMUM LOAD
CAPACITANCE
12V
7.4A
800μF
3.3VAUX
150mA
150μF
Table 3. MicroTCA Power Supply Requirements
SUPPLY VOLTAGE
MAXIMUM LOAD
CURRENT
MAXIMUM LOAD
CAPACITANCE
12V
7.6A
1600μF
3.3VAUX
150mA
150μF


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