Data Sheet G17933EJ3V0DS

9

RECOMMENDED SOLDERING CONDITIONS

The

conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Surface Mount Device

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 260

°C, Reflow time: 60 seconds or less (at 220°C or higher),

Maximum number of reflow processes: 3 times.

IR60-00-3

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less, Maximum

number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

WS60-00-1

Partial heating method

Pin temperature: 350

°C or below,

Heat time: 3 seconds or less (Per each side of the device).

P350

Note Pb-free (This product does not contain Pb in external electrode and other parts.)

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the

device will be damaged by heat stress.

Remark Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

REFERENCE DOCUMENTS

Document Name

Document No.

QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES

C11531E

SEMICONDUCTOR DEVICE MOUNT MANUAL

http://www.necel.com/pkg/en/mount/index.html

NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL

SYSTEM-STANDARD LINEAR IC

IEI-1212

REVIEW OF QUALITY AND RELIABILITY HANDBOOK

C12769E

NEC SEMICONDUCTOR DEVICE RELIBIALITY/QUALITY CONTROL

SYSTEM

C10983E

<R>

<R>