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DSPA56721AF Datasheet(PDF) 10 Page - Freescale Semiconductor, Inc |
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DSPA56721AF Datasheet(HTML) 10 Page - Freescale Semiconductor, Inc |
10 / 54 page SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors, Rev.1 Freescale Semiconductor 10 2.1.2 Thermal Characteristics For thermal characteristics, see Table 5. 2.1.3 Power Requirements To prevent high current conditions due to possible improper sequencing of the power supplies, use an external Schottky diode as shown in Figure 6, connected between the DSP56720/DSP56721 IO_VDD and Core_VDD power pins. Figure 6. Prevent High Current Conditions by Using External Schottky Diode If an external Schottky diode is not used (to prevent a high current condition at power-up), then IO_VDD must be applied ahead of Core_VDD, as shown in Figure 7. Figure 7. Prevent High Current Conditions by Applying IO_VDD Before Core_VDD For correct operation of the internal power-on reset logic, the Core_VDD ramp rate (Tr) to full supply must be less than 10 ms, as shown in Figure 8. Table 5. Thermal Characteristics Characteristic Board Type Symbol LQFP Values Unit Natural Convection, Junction-to-ambient thermal resistance1,2 Single layer board (1s) RθJA or θJA 57 for 80 QFP 49 for 144 QFP °C/W Four layer board (2s2p) 44 for 80 QFP 40 for 144 QFP °C/W Junction-to-case thermal resistance3 –RθJC or θJC 10 for 80 QFP 9 for 144 QFP °C/W Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 3. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). IO_VDD Core_VDD External Schottky Diode Core_VDD IO_VDD |
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