CMG02 datasheet(3/4 Pages) TOSHIBA

Part #	CMG02

Description	General Purpose Rectifier Applications

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Manufacturer	TOSHIBA [Toshiba Semiconductor]

Direct Link	http://www.semicon.toshiba.co.jp/eng

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CMG02

2006-11-06

3

Instantaneous forward voltage vF

(V)

iF – vF

0.2 0.4

0.01

0.1

1

100

0.6

0.8

1.2 1.4

Pulse test

Average forward current IF (AV) (A)

PF (AV) – IF (AV)

0.0

0.4

2.4

0.6

1.2

0.0

0.4 0.6

2.4

0.2

0.8

2.0

Average forward current IF (AV) (A)

Tℓ max – IF (AV)

0.0

0

40

160

0.2

0.6 0.8 1.0

1.4

2.2

20

60

120

100

0.4

1.2

80

140

Average forward current IF (AV) (A)

Ta max – IF (AV)

0

40

160

0.2

0.6 0.8 1.0

1.4

2.2

20

60

120

100

0.4

1.2

80

140

Number of cycles

Surge forward current

(non-repetitive)

1

100

10

0

10

100

30

20

40

3

5

30

50

Time t (s)

rth (j-a) – t

1000

0.1

100

0.001

1000

0.01

0.1

100

10

1

Device mounted on a glass-epoxy

board:

board size: 50 mm

× 50 mm

Soldering land: 2.1 mm

× 1.4 mm

board thickness: 1.6 t

Device mounted on a glass-epoxy

board:

board size: 50 mm

× 50 mm

Soldering land: 6.0 mm

× 6.0 mm

board thickness: 1.6 t

Device mounted on a ceramic

board:

board size: 50 mm

× 50 mm

Soldering land: 2.0 mm

× 2.0 mm

board thickness: 0.64 t

1

10

Halfsine waveform

180°

0°

Conduction angle 180°

Halfsine waveform

180°

0°

Conduction angle 180°

Halfsine waveform

180°

0°

Conduction angle 180°

1.0

1.6 1.8 2.0

2.2 2.4

10

1.0 1.2 1.4 1.6 1.8 2.0 2.2

0.2

0.8

1.0

1.4

1.6

1.8

2.2

1.6 1.8

2.0

1.6

1.8 2.0

50

60

70

80

90

Device mounted on a glass-epoxy board:

Soldering land: 2.1 mm

× 1.4 mm

Device mounted on a glass-epoxy board:

Soldering land: 6.0 mm

× 6.0 mm

Device mounted on a ceramic board:

Soldering land: 2.0 mm

× 2.0 mm

25°C

75°C

Tj = 150°C

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