CCD area image sensor

S7847 series

KMPDC0089EA

q Line binning

Parameter

Symbol

Remark

Min.

Typ.

Max.

Unit

Pulse width

Tpwv

--

µs

P1V, P2V, TG

Rise and fall time

Tprv, Tpfv

200

-

-

ns

Pulse width

Tpwh

250

-

-

ns

Rise and fall time

Tprh, Tpfh

10

-

-

ns

P1H, P2H

Duty ratio

-

-

50

-

%

Pulse width

Tpws

250

-

-

ns

Rise and fall time

Tprs, Tpfs

10

-

-

ns

SG

Duty ratio

-

-

-50

-

%

Pulse width

Tpwr

100

-

-

ns

RG

Rise and fall time

Tprr, Tpfr

-

5

-

-

ns

TG – P1H

Overlap time

Tovr

-

3

-

-

µs

*18: Symmetrical pulses should be overlapped at 50 % of maximum amplitude.

*19: In case of S7847-1007.

s Specifications of built-in TE-cooler

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Internal resistance

Rint

Ta=27 °C

-

1.6

-

Ω

Imax

-

-

4.4

A

Maximum voltage

Vmax

∆T=∆Tmax

I=Imax

--

7.4

V

Qmax

I=Imax

-

-

3.0

W

Maximum temperature at hot side

-

-

-

50

°C

CCD temperature

-

Ta=25 °C

-

-70

-50

°C

*20: If the current is greater than Imax, the heat absorption begins to decrease due to the Joule heat. It should be noted that

this value is not a damage threshold. To protect the thermoelectric cooler (Peltier element) and maintain stable operation,

the supply current should be less than 60 % of this maximum current.

*21: Temperature at hot side of thermoelectric cooler.

*22:

∆T=Th - Tc

*23: This is a theoretical heat absorption level that offsets the temperature difference in the Peltier element when the maximum

current is supplied to the unit.

*24: Temperature at cool side of thermoelectric cooler.

INTEGRATION PERIOD

(Shutter must be open)

VERTICAL BINNING PERIOD

(Shutter must be closed)

3..126

3..254

127

255

128

←

256

←

P1V

P2V, TG

P1H

P2H, SG

READOUT PERIOD (Shutter must be closed)

124+4 (ISOLATION): S7847-1007

252+4 (ISOLATION): S7847-1008

Tpwv

Tovr

Tpwh, Tpws

Tpwr

12

3

1043

1044

4..1042

12

D19

D2

D1

D20

D3..D10, S1..S1024, D11..D18

RG

OS

7