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CF5035ALA-1 Datasheet(PDF) 2 Page - Nippon Precision Circuits Inc |
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CF5035ALA-1 Datasheet(HTML) 2 Page - Nippon Precision Circuits Inc |
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2 / 8 page  CF5035 series SEIKO NPC CORPORATION —2 PAD LAYOUT (Unit: µm) PIN DESCRIPTION and PAD DIMENSIONS BLOCK DIAGRAM Chip size: 1.08 × 1.32mm Chip thickness: 300 ± 30µm PAD size: 100µm × 100µm (TEST: 80µm × 80µm) Chip base: VSS potential No. Name I/O Description Pad dimensions [µm] XY 1 INHN I Output state control input. Oscillator stops when LOW. Power-saving pull-up resistor built-in. 205 135 2 XIN I Oscillator input Crystal connection pins. Crystal is connected between XIN and XOUT. 461 135 3 XOUT O Oscillator output 734 135 4 VSS – (–) ground 945 135 5 Q O Output. Output frequency. High impedance in standby mode 945 1185 6 TEST I Test (leave open) 494 1195 7 VDD – (+) supply voltage 135 1185 (0,0) (1080,1320) X Y 1 INHN TEST VSS XIN XOUT 23 4 5 6 7 VDD Q XIN INHN XOUT Q CMOS Rf CIN COUT VSS VDD |
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