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CF1155 Datasheet(PDF) 2 Page - Nippon Precision Circuits Inc |
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CF1155 Datasheet(HTML) 2 Page - Nippon Precision Circuits Inc |
2 / 8 page CF1155 series SEIKO NPC CORPORATION —2 PAD LAYOUT and COORDINATES (Unit: µm) PAD DESCRIPTION Chip size: 1.23 × 1.23mm Chip thickness: 300 ± 30µm T1, T2, TC, and TO bonding is not required. VDD (0,0) (1230,1230) 1 2 3 4 5 6 78 9 10 11 OUT OUT TC T2 T1 VSS TO OSH LH VSS Number Pad Pad dimensions (Unit: µm) XY 1 OUT 930 1075 2 OUT 529 1075 3 VDD 155 1075 4 TC 155 887 5 T2 155 608 6 T1 155 420 7 VSS 223 155 8 TO 486 155 9 OSH 750 155 10 LH 1041 155 11 VSS 1075 420 Name Function OSH, LH Melody mode control inputs. Built-in pull-down resistors mean LOW-level signals are obtained when inputs are open circuit. The resistance of the pull-down resistor varies with the applied voltage, as described in the Electrical Characteristics. OUT, OUT Piezoelectric speaker driver outputs. Both pins are LOW in non-play mode. OUT is LOW and OUT is HIGH during output for a musical rest note. Both pins are HIGH during the gap between musical notes. VDD Supply. The rear surface of the chip is VDD level. VSS Ground T1, T2, TC Test inputs. Pull-down resistor built-in. TO Test output. The oscillator frequency (typ. 50kHz) is output for monitoring purposes. |
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