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TPS61160 Datasheet(PDF) 4 Page - Texas Instruments

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Part No. TPS61160
Description  White LED Driver With Digital and PWM Brightness Control in 2mm x 2mm QFN Package for up to 10 LEDs in Series
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TPS61160 Datasheet(HTML) 4 Page - Texas Instruments

 
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DEVICE INFORMATION
VIN
CTRL
SW
FB
COMP
GND
TOP VIEW
Thermal
Pad
6-PIN2mmx2mmx0.8mmQFN
TPS61160
TPS61161
SLVS791 – NOVEMBER 2007
ELECTRICAL CHARACTERISTICS (continued)
VIN = 3.6 V, CTRL = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EasyScale TIMING
tstart
Start time of program stream
2
µs
tEOS
End time of program stream
2
360
µs
tH_LB
High time low bit
Logic 0
2
180
µs
tL_LB
Low time low bit
Logic 0
2
× t
H_LB
360
µs
tH_HB
High time high bit
Logic 1
2
× t
L_HB
360
µs
tL_HB
Low time high bit
Logic 1
2
180
µs
VACKNL
Acknowledge output voltage low
Open drain, Rpullup =15 k
Ω to VIN
0.4
V
tvalACKN
Acknowledge valid time
See (2)
2
µs
tACKN
Duration of acknowledge condition
See (2)
512
µs
THERMAL SHUTDOWN
Tshutdown
Thermal shutdown threshold
160
°C
Thysteresis
Thermal shutdown threshold hysteresis
15
°C
(2)
Acknowledge condition active 0, this condition will only be applied in case the RFA bit is set. Open drain output, line needs to be pulled
high by the host with resistor load.
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
VIN
6
I
The input supply pin for the IC. Connect VIN to a supply voltage between 2.7V and 18V.
This is the switching node of the IC. Connect the inductor between the VIN and SW pin. This pin is also
SW
4
I
used to sense the output voltage for open LED protection
GND
3
O
Ground
FB
1
I
Feedback pin for current. Connect the sense resistor from FB to GND.
Output of the transconductance error amplifier. Connect an external capacitor to this pin to compensate the
COMP
2
O
regulator.
Control pin of the boost regulator. It is a multi-functional pin which can be used for enable control, PWM
CTRL
5
I
and digital dimming.
The thermal pad should be soldered to the analog ground plane. If possible, use thermal via to connect to
Thermal Pad
ground plane for ideal power dissipation.
4
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Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TPS61160 TPS61161


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