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ES4810SAA Datasheet(PDF) 3 Page - ESS Technology,Inc

Part No. ES4810SAA
Description  Digital Audio Processor Product Brief
Download  4 Pages
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Maker  ESS [ESS Technology,Inc]
Homepage  http://www.esstech.com
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ES4810SAA Datasheet(HTML) 3 Page - ESS Technology,Inc

   
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ESS Technology, Inc.
SAM0660-080406
3
ES4810SAA PRODUCT BRIEF
P C BOARD LAYOUT CONSIDERATIONS
PRELIMINARY
P C BOARD LAYOUT CONSIDERATIONS
Required Printed Circuit Board Layout
The ES4810 LQFP package requires additional heat
sinking to prevent heat-caused damage to the chip. To
accomplish this heat dissipation in an economical manner,
the following printed circuit board (PCB) layout is required.
The land pattern for the chips still use the standard 208-pin
LQFP footprint on the PCB with the addition of the heat
sink, as shown in Figure 3. Required for heat dissipation is
the addition of a solid copper fill on the top and bottom
layers of the PCB, along with 1mm square solder mask
exposures and via in the center of each exposure.
The metal land on the underside of the IC must have more
than 90% of its surface area directly soldered onto the
PCB (i.e., the solder mask openings as shown below) for
the heat dissipation to be effective.
It is not recommended to route any traces between the
land pattern and metal land.
The specifications for the LQFP heat sinking is listed in
Table 1
Figure 3 Required PCB Layout for Heat Dissipation
Table 1
LQFP Heat Sink Specifications
Parameters
Dimensions
Parameters
Dimensions
PCB Layers
4, minimum
Via diameter
0.3 mm
Solder mask opening (top layer)
1.0
× 1.0 mm
Via spacing (center to center)
1.2 mm
Solder mask width
0.2 mm
Via plating
must be plugged
VIA, 0.3 dia.
solder mask (top layer)
solder mask opening (top layer)
SAM0508-03
0.2
1.0
1.2
0.2
0.2
0.2
1.0
1.2
Dimensions
in mm
7.4
7.4


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