LNBTVSx-22xx

Package information

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Figure 4.

SMB footprint (dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 6.

SMB package dimensions

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max.

Min.

Max.

A1

1.90

2.45

0.075 0.096

A2

0.05

0.20

0.002 0.008

b

1.95

2.20

0.077 0.087

c

0.15

0.41

0.006 0.016

E

5.10

5.60

0.201 0.220

E1

4.05

4.60

0.159 0.181

D

3.30

3.95

0.130 0.156

L

0.75

1.60

0.030 0.063

Table 7.

DO-201 package dimensions

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max.

Min.

Max.

A

8.5

9.5

0.335

0.374

B25.4

1

Ø C

4.8

5.3

0.189

0.209

Ø D

0.96

1.06

0.038

0.042

E

C

L

E1

D

A1

A2

b

2.60

5.84

1.62

2.18

1.62

ØC

ØD

A

BB