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W55RFS27T1B Datasheet(PDF) 8 Page - Winbond |
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W55RFS27T1B Datasheet(HTML) 8 Page - Winbond |
8 / 17 page W55RFS27T1B -8- 3.3 W55RFS27T1B Ordering Information The W55RFS27T1B is available in two forms: Dice form and wafer form. PART NUMBER PACKAGE REMARKS W55RFS27T1B(H) Dice form - W55RFS27T1B(W) Wafer form - 3.4 W55RFS27T1B Package Information 3.4.1 Bonding Pad List Window : (xl = -620.000, yl = -635.000),(xh = 620.000, yh = 635.000) Windows size : Width = 1240.000, length = 1270.000 ============================================================================ PAD NO PAD NAME PIN NAME X Y ----------------------------------------------------------------------------- 1 S3 1 -535.000 -69.260 2 S4 2 -535.000 -360.520 3 CKSEL0 3 -535.000 -484.865 4 TEST 4 66.325 -550.000 5 CKSEL1 5 173.325 -550.000 6 ANT 6 282.725 -550.000 7 * VSS * 7 535.000 -218.395 8 VDD 8 535.000 20.945 9 RESET 9 535.000 284.600 10 X1 10 245.005 550.000 11 X2 11 138.005 550.000 12 ID1 12 31.005 550.000 13 ID0 13 -75.995 550.000 14 TXOUT 14 -288.420 550.000 15 S1 15 -535.000 329.000 16 S2 16 -535.000 37.740 ============================================================================ (*: Bonding Sequence start from VSS(Pin7)) |
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