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MF-SMHT136 Datasheet(PDF) 3 Page - Bourns Electronic Solutions |
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MF-SMHT136 Datasheet(HTML) 3 Page - Bourns Electronic Solutions |
3 / 4 page Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Typical Time to Trip at 23 ˚C 0.01 0.1 0.001 1 10 100 1 10 Fault Current (Amps) MF-SMHT136 MF-SMHT160 MF-SMHT Series - PTC Resettable Fuses MF-SMHT SERIES, REV. D, 08/05 Solder Reflow Recommendations 160–220 300 250 200 150 100 50 0 10–20 120 Preheating Soldering Cooling Time (seconds) Solder reflow • Recommended reflow methods: IR, vapor phase oven, hot air oven. • Devices are not designed to be wave soldered to the bottom side of the board. • Gluing the devices is not recommended. • Recommended maximum paste thickness is 0.25 mm (.010 inch). • Devices can be cleaned using standard industry methods and solvents. Note: • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Rework • A device should not be reworked. The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. |
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