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5

4

7

3

8

1

2

2

BOOT

UGATE

PHASE

LGATE

GND

1

8

5

4

6 VDD

EN/PG

7

PWM

3

2

BOOT

UGATE

PHASE

LGATE

GND

1

8

5

4

6 VDD

EN/PG

7

PWM

3

VIN

PWM 4

GND

VOUT

PWM1

8

PWM3

Enable

PWM2

To Driver

To Driver

GNDS

To Controller

CSCN

CS 4

To Controller

CS 1

TPS28226

TPS28226

TPS28226

SLUS791 – OCTOBER 2007

TYPICAL APPLICATIONS (continued)

Multi-Phase Synchronous Buck Converter

PART NUMBER

PACKAGE

TAPE AND REEL QTY.

TPS28226

Plastic 8-pin SOIC (D)

75 per tube

TPS28226D

Plastic 8-pin SOIC (D)

2500

TPS28226DR

-40C to 125C

Plastic 8-pin DFN (DRB)

250

TPS28226DRBT

Plastic 8-pin DFN (DRB)

3000

TPS28226DRBR

(1)

SOIC-8 (D) and DFN-8 (DRB) packages are available taped and reeled. Add T suffix to device type (e.g. TPS28226DRBT) to order

taped devices and suffix R (e.g. TPS28226DRBR) to device type to order reeled devices.

(2)

The SOIC-8 (D) and DFN-8 (DRB) package uses in Pb-Free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255C to

260C peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.

(3)

In the DFN package, the pad underneath the center of the device is a thermal substrate. The PCB “thermal land” design for this

exposed die pad should include thermal vias that drop down and connect to one or more buried copper plane(s). This combination of

vias for vertical heat escape and buried planes for heat spreading allows the DFN to achieve its full thermal potential. This pad should

be either grounded for best noise immunity, and it should not be connected to other nodes.

4

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Product Folder Link(s): TPS28226