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STK12C68-L Datasheet(PDF) 2 Page - Simtek Corporation

Part No. STK12C68-L
Description  Statement of Material Content Ceramic LCC Packages
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Maker  SIMTEK [Simtek Corporation]
Homepage  http://www.simtek.com
Logo SIMTEK - Simtek Corporation

STK12C68-L Datasheet(HTML) 2 Page - Simtek Corporation

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This package type is not available in a lead-free version.
Detail
Unit
28 350 LEADLESS CHIP CARRIER
32 450 LEADLESS CHIP CARRIER
Statement of Material Content
Ceramic LCC Packages
STK11C68-L
STK12C68-L
STK14C88-L
ASSEMBLY MATERIALS
Die Attach
JMI 7000
JMI 7000
Manufacturer
Johnson Matthey
Johnson Matthey
Die Attach Type
Silver Glass
Silver Glass
Die Attach Thickness
mil
0.5 - 1.0 mil
0.5 - 1.0 mil
Die Thickness
mil
19 mil
19 mil
Die Coating
None
None
Wire Bond Material
Al 99.99%
Al 99.99%
Wire Bond Diameter
mil
1.25 mil
1.25 mil
ASSEMBLY PROCESS FLOW
Flow ID
P596-0501-0202
P596-0501-0202
Wafer Mount
Non Contact
Non Contact
Scribe Method
Complete Saw Through
Complete Saw Through
Saw/Clean
CO2 bubbler
CO2 bubbler
2nd optical
High Power. 100%
High Power. 100%
2nd optical QA
High Power. 45 C=0
High Power. 45 C=0
Die Attach Method
Manual
Manual
Die Attach Cure
150-160°C, 10-30 minutes
150-160°C, 10-30 minutes
Bonder: Manual/Auto
Automatic
Automatic
Bond Type: Forward/Reverse
Reverse
Reverse
Bond Type: At The Die
Ball
Ball
Bond Type: At The Paddle
Stitch
Stitch
3rd Optical
Low & High Power. 100%
Low & High Power. 100%
3rd Optical QA
Low & High Power. 45 C=0
Low & High Power. 45 C=0
Seal Method/Atmosphere
Furnace / Nitrogen
Furnace / Nitrogen
Lid Seal Temp Profile
°C
Peak 420+/-5°C
Peak 420+/-5°C
min
Dwell 7-10 Minutes @ 410°C
Dwell 7-10 Minutes @ 410°C
min
Rise 60.5 Min 100-400°C
Rise 60.5 Min 100-400°C
Cool 2.0-3.5 minutes 400-200°C
Cool 2.0-3.5 minutes 400-200°C
Marking Ink
Markem 4489 White
Markem 4489 White
Backside Mark
[lot #] [assembly country]
[lot #] [assembly country]
Ink Cure
150°C+10°C -0°C 1hr +30 -0 minutes
150°C+10°C -0°C 1hr +30 -0 minutes
Temp Cycle
100% 10 cycles, -65°C to +150°C
100% 10 cycles, -65°C to +150°C
Centrifuge
100% 30KG
100% 30KG
Fine Leak
100% He 5x10
-8 atm cc/sec
100% He 5x10
-8 atm cc/sec
Gross Leak
100% 5torr 0.5H 75psig 1H
100% 5torr 0.5H 75psig 1H
Final Visual QA
100%
100%
Pack & Ship
45, C=0
45, C=0
PROCESS MONITORS
Wire Bond Monitor
Amkor Procedure
Amkor Procedure
Die Attach Monitor
Amkor Procedure
Amkor Procedure
Lid Seal Monitor
Amkor Procedure
Amkor Procedure
PIND Monitor
Amkor Procedure
Amkor Procedure
Lead Trim Monitor
Amkor Procedure
Amkor Procedure
Seal Area Particulate Monitor
Amkor Procedure
Amkor Procedure
Area Particle Count Limits
10,000 In D/A, Wire Bond Areas
10,000 In D/A, Wire Bond Areas
PL0122
Simtek Corporation
August 07


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