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SB650F Datasheet(PDF) 1 Page - Pan Jit International Inc. |
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SB650F Datasheet(HTML) 1 Page - Pan Jit International Inc. |
1 / 2 page PAGE . 1 STAD-MAY.05.2004 DATA SHEET FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding Compound. • Exceeds environmental standards of MIL-S-19500/228 • Low power loss, high efficiency. • Low forwrd voltge, high current capability • High surge capacity. • For use in low voltage,high frequency inverters free wheeling , and polarlity protection applications. • Pb free product are available : 99% Sn above can meet Rohs environment substance directive request SB620F~SB660F ISOLATION SCHOTTKY BARRIER RECTIFIERS .189(4.8) .406(10.3) .130(3.3) .114(2.9) .071(1.8) .055(1.4) .035(0.9) .011(0.3) (2.55) (2.55) .1 .1 .032(.8) .134(3.4) .165(4.2) .381(9.7) .114(2.9) .098(2.5) .055(1.4) .039(1.0) MAX .118(3.0) ITO-220AC Unit : inch (mm) VOLTAGE 20 to 60 Volts 6.0 Ampers CURRENT MECHANICALDATA Case: ITO-220AC full molded plastic package Terminals: Lead solderable per MIL-STD-202G, Method 208 Polarity: As marked. Mounting Position: Any Weight: 0.08 ounces, 2.24grams. MAXIMUM RATINGSAND ELECTRICALCHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% R E T E M A R A PL O B M Y SF 0 2 6 B SF 0 3 6 B SF 0 4 6 B SF 0 5 6 B SF 0 6 6 B SS T I N U e g a t l o V e s r e v e R k a e P t n e r r u c e R m u m i x a M V RRM 0 20 30 40 50 6V e g a t l o V S M R m u m i x a M V RMS 4 11 28 25 32 4V e g a t l o V g n i k c o l B C D m u m i x a M V DC 0 20 30 40 50 6V ) m m 5 . 9 ( " 5 7 3 . t n e r r u C d r a w r o F e g a r e v A m u m i x a M T t a h t g n e l d a e lc 5 7 = OC IAV 0 . 6A e v a w - e n i s f l a h e l g n i s s m 3 . 8 : t n e r r u C e g r u S d r a w r o F k a e P ) d o h t e m C E D E J ( d a o l d e t a r n o d e s o p m i r e p u s IFS M 5 7A A 0 . 6 t a e g a t l o V d r a w r o F m u m i x a M V F 5 5 . 00 7 . 0V T t n e r r u C e s r e v e R C D m u m i x a M C 5 2 = OC T e g a t l o V g n i k c o l B C D d e t a R t a C 0 0 1 = OC IR 2 . 0 5 1 A m c n a t s i s e R l a m r e h T l a c i p y Te R θ C J R θ A J 6 0 8 O W / C e g n a R e r u t a r e p m e T n o i t c n u J g n i t a r e p O TJ 5 2 1 + o t 0 5 - OC e g n a R e r u t a r e p m e T e g a r o t S TJ T , STG 0 5 1 + o t 0 5 - OC NOTES: Both Bonding and Chip structure are available. |
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