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TDA7294 Datasheet(PDF) 10 Page - STMicroelectronics |
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TDA7294 Datasheet(HTML) 10 Page - STMicroelectronics |
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10 / 17 page  TDA7294 3 1 4 13 7 815 2 14 6 10 R3 680 C11 22 µF L3 5 µH 270 R16 13K C15 22 µF 9 R16 13K C13 10 µF R13 20K C11 330nF R15 10K C14 10 µF R14 30K D5 1N4148 PLAY ST-BY 270 L1 1 µH T1 BDX53A T3 BC394 D3 1N4148 R4 270 R5 270 T4 BC393 T5 BC393 R6 20K R7 3.3K C16 1.8nF R8 3.3K C17 1.8nF Z2 3.9V Z1 3.9V L2 1 µH 270 D4 1N4148 D2 BYW98100 R1 2 R2 2 C9 330nF C10 330nF T2 BDX54A T6 BC393 T7 BC394 T8 BC394 R9 270 R10 270 R11 29K OUT IN C7 100nF C5 1000 µF C8 100nF C6 1000 µF C1 1000 µF C2 1000 µF C3 100nF C4 100nF +40V +20V D1 BYW98100 GND -20V -40V D93AU016 Figure 18: High Efficiency Application Circuit APPLICATION INFORMATION HIGH-EFFICIENCY Constraints of implementing high power solutions are the power dissipation and the size of the power supply. These are both due to the low effi- ciency of conventional AB class amplifier ap- proaches. Here below (figure 18) is described a circuit pro- posal for a high efficiency amplifier which can be adopted for both HI-FI and CAR-RADIO applica- tions. The TDA7294 is a monolithic MOS power ampli- fier which can be operated at 80V supply voltage (100V with no signal applied) while delivering out- put currents up to ±10 A. This allows the use of this device as a very high power amplifier (up to 180W as peak power with T.H.D.=10 % and Rl = 4 Ohm); the only drawback is the power dissipation, hardly manageable in the above power range. Figure 20 shows the power dissipation versus output power curve for a class AB amplifier, com- pared with a high efficiency one. In order to dimension the heatsink (and the power supply), a generally used average output power value is one tenth of the maximum output power at T.H.D.=10 %. From fig. 20, where the maximum power is around 200 W, we get an average of 20 W, in this condition, for a class AB amplifier the average power dissipation is equal to 65 W. The typical junction-to-case thermal resistance of the TDA7294 is 1 oC/W (max= 1.5 oC/W). To avoid that, in worst case conditions, the chip tem- perature exceedes 150 oC, the thermal resistance of the heatsink must be 0.038 oC/W (@ max am- bient temperature of 50 oC). As the above value is pratically unreachable; a high efficiency system is needed in those cases where the continuous RMS output power is higher than 50-60 W. The TDA7294 was designed to work also in higher efficiency way. For this reason there are four power supply pins: two intended for the signal part and two for the power part. T1 and T2 are two power transistors that only op- erate when the output power reaches a certain threshold (e.g. 20 W). If the output power in- creases, these transistors are switched on during the portion of the signal where more output volt- age swing is needed, thus "bootstrapping" the power supply pins (#13 and #15). The current generators formed by T4, T7, zener TDA7294 10/17 |
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