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RT9018B12PQW Datasheet(PDF) 10 Page - Richtek Technology Corporation |
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RT9018B12PQW Datasheet(HTML) 10 Page - Richtek Technology Corporation |
10 / 12 page RT9018A/B 10 DS9018A/B-04 September 2007 www.richtek.com PD (MAX) = (125 °C − 25°C) / (75°C/W) = 1.33W (SOP-8 Exposed Pad on the minimum layout) Layout Considerations The thermal resistance θJA of SOP-8 (Exposed Pad) is determined by the package design and the PCB design. However, the package design had been designed. If possible, it ’ s useful to increase thermal performance by the PCB design. The thermal resistance θJA can be decreased by adding a copper under the exposed pad of SOP-8 (Exposed Pad) package. As shown in Figure 3, the amount of copper area to which the SOP-8 (Exposed Pad) is mounted affects thermal performance. When mounted to the standard SOP-8 (Exposed Pad) pad (Figure 3.a), θJA is 75°C/W. Adding copper area of pad under the SOP-8 (Exposed Pad) Figure 3.b) reduces the θJA to 64°C/W. Even further, increasing the copper area of pad to 70mm2 (Figure 3.e) reduces the θJA to 49°C/W. The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA . For RT9018A/B packages, the Figure 4 of de-rating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. Figure 3 (a). Minimum Footprint, θJA = 75°C/W Figure 3 (b). Copper Area = 10mm2, θJA= 64°C/W Figure 3 (c). Copper Area = 30mm2, θJA= 54°C/W Figure 4. De-rating Curves Figure 3. Thermal Resistance vs. Different Cooper Area Layout Design Figure 3 (d). Copper Area = 50mm2, θJA = 51°C/W Figure 3 (e). Copper Area = 70mm2, θJA = 49°C/W 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 0 20 40 60 80 100 120 140 Ambient Temperature (°C) JEDEC 4-Layers PCB 70mm 2 50mm 2 30mm 2 10mm 2 Minimum Layout Copper Area |
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