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RT9173GL5 Datasheet(PDF) 10 Page - Richtek Technology Corporation |
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RT9173GL5 Datasheet(HTML) 10 Page - Richtek Technology Corporation |
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10 / 13 page  RT9173/A 10 DS9173/A-18 March 2007 www.richtek.com Figure 11. Power Dissipation vs. Copper Area of SOP-8 Package Figure 12. Power Dissipation vs. Copper Area of TO-263-5 Package can be calculated as : PD(MAX) = (125 °C - 25°C) / (29°C/W) = 3.45W (TO-263-5) Figure 11 and Figure 12 of power dissipation vs. copper area allow the designer to see the effect of rising ambient temperature on the maximum power allowed. Cooper Area vs. Power Dissipation 0 50 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Power Dissipation (W) TA= 65 °C TA= 55 °C TA= 25°C TO-263-5 2S2P thermal test board Power Dissipation vs. Copper Area 0 10 20 30 40 50 60 70 80 90 100 00.5 11.5 22.5 3 Power Dissipation (W) TA= 65 °C TA= 55 °C TA= 25 °C 2S2P thermal test board SOP-8 |
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