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RT9173PL5 Datasheet(PDF) 9 Page - Richtek Technology Corporation |
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RT9173PL5 Datasheet(HTML) 9 Page - Richtek Technology Corporation |
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9 / 13 page  RT9173/A 9 DS9173/A-18 March 2007 www.richtek.com Figure 7. The Package Section Drawing of RT9173/A SOP-8 Package Figure 8. Thermal Resistance Equivalent Circuit of RT9173/A SOP-8 Package The thermal resistance θJA of IC package is determined by the package design and the PCB design. However, the package design has been decided. If possible, it's useful to increase thermal performance by the PCB design. The thermal resistance can be decreased efficiently by adding copper under the main path of thermal flow on the package. The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. For RT9173/A package, the Figure 9 and the Figure 10 show the thermal resistance θJA vs. copper area of SOP-8 and TO-263-5 packages on single layer (1S) and 4-layer (2S2P) thermal test board at TA = 25 °C, PCB copper thickness = 2oz. Figure 10. Thermal Resistance θJA vs. Copper Area of TO-263-5 Packages For example, as shown in Figure 9, RT9173/A SOP-8 with 10mm x 10mm cooper area on 4-layers (2S2P) thermal test board at TA = 25 °C, we can obtain the lower thermal resistance about 45 °C/W. The power maximum dissipation can be calculated as : PD(MAX) = (125 °C - 25°C) / (45 °C/W) = 2.22W (SOP-8) As shown in Figure 10, RT9173/A TO-263-5 with 15mm x 15mm cooper area on 4-layers (2S2P) thermal test board at TA = 25 °C, we can obtain the lower thermal resistance about 29 °C/W. The power maximum dissipation Ambient Molding Compound Gold Wire Lead Frame Die Pad Die Die Pad Molding Compound Lead Frame Case Point Junction R DIE R DIE-ATTACH R DIE-PAD R GOLD-LINE R LEAD FRAME R PCB R PCB Ambient R MOLDING-COMPOUND path 1 path 2 path 3 R LEAD FRAME Internally Fused θJA vs. Copper Area 30 40 50 60 70 80 90 100 0 1020 3040 5060 7080 90 100 Copper Area (mm 2) SOP-8 2S2P thermal test board Figure 9. Thermal Resistance θJA vs. Copper Area of SOP-8 Packages Thermal Resistance vs. Cooper Area 0 10 20 30 40 50 60 70 0 50 100 150 200 250 300 350 400 Cooper Area (mm 2) TO-263-5 1S thermal test board 2S2P thermal test board |
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