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RT9133AGQW Datasheet(PDF) 9 Page - Richtek Technology Corporation |
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RT9133AGQW Datasheet(HTML) 9 Page - Richtek Technology Corporation |
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9 / 13 page  RT9133A/B Preliminary 9 DS9133A/B-04 August 2007 www.richtek.com Applications Information The RT9133A/B has high performance to drive large load for different application. High slew rates, rail-to-rail input and output capability and low power consumption are the features to make the RT9133A/B ideal for LCD applications. The RT9133A/B also has wide bandwidth and phase margin to drive a load of 10k Ω and 10pF. Operating Voltage The RT9133A/B is specified with single supply voltage from 5V to 15V. According to the electrical characteristics, the total supply voltage range is guaranteed from 4.5V to 15V. To refer the typical operational curves can get stable specifications in wide range of temperature and operating voltage. The output swing of the RT9133A/B typically extends to within 80mV of positive/negative supply rails with 5mA load current source/sink. Decreasing the load current will get output swing even closer to the supply rails. Figure 1 shows the rail-to-rail input and output waveforms in the unit gain configuration without load current. The supply rails are +/-5V. Applying an input 10Vp_p sinusoidal waveform results in a 9.8Vp_p output voltage as shown in Figure 1. Power Dissipation The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between Figure 1. Operation with Rail-to-Rail Input and Output Time (250 μs/Div) junction to ambient. The maximum power dissipation can be calculated by following formula: PD(MAX) = ( TJ(MAX) - TA ) / θJA Where TJ(MAX): The maximum operation junction temperature 150 °C TA : The ambient temperature. θJA : The junction to ambient thermal resistance. The recommended operating condition of RT9133A/B is below the maximum junction temperature 150 °C of the die. The junction to ambient thermal resistance for SOT-23-5 package is 250 °C/W, WDFN-6L 2x2 package is 165 °C/W and MSOP-8 package is 160°C/W on the standard JEDEC 51-3 single layer thermal test board. The maximum power dissipation at TA= 25 °C can be calculated by following formula: PD(MAX) = (150 °C−25°C) / 250 = 500mW (SOT-23-5) PD(MAX) = (150 °C−25°C) / 165 = 758mW (WDFN-6L 2x2) PD(MAX) = ( 150 °C - 25°C ) / 160 = 781mW (MSOP-8) For continuous operation, do not exceed absolute maximum operation junction temperature 150 °C. The power dissipation definition for the RT9133A/B is as following: PD = (VS - VOUT) x ILoad VS : the supply voltage VOUT : the output voltage ILoad : the output load current The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. Figure 2 shows the power dissipation derating curves of the RT9133A/B with different packages. As the ambient temperature increases, the maximum power dissipation decreases linearly to keep the junction temperature below 150 °C. |
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