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RT9013-1BPB Datasheet(PDF) 9 Page - Richtek Technology Corporation

Part # RT9013-1BPB
Description  500mA, Low Dropout, Low Noise Ultra-Fast Without Bypass Capacitor CMOS LDO Regulator
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT9013-1BPB Datasheet(HTML) 9 Page - Richtek Technology Corporation

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RT9013
Preliminary
9
DS9013-05 August 2007
www.richtek.com
Figure 2. Derating Curves for RT9013 Packages
Where TJ(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the
θJA is
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9013, where TJ(MAX) is the maximum junction
temperature of the die (125
°C) and TA is the operated
ambient temperature. The junction to ambient thermal
resistance
θJA JA is layout dependent) for WDFN-6L 2x2
package is 165
°C/W, SOT-23-5 package is 250°C/W and
SC-70-5 package is 333
°C/W on the standard
JEDEC 51-3 single-layer thermal test board. The maximum
power dissipation at TA = 25
°C can be calculated by
following formula :
PD(MAX) = (125
°C − 25°C) / 165 = 0.606 W for
WDFN-6L 2x2 packages
PD(MAX) = (125
°C − 25°C) / 250 = 0.400 W for SOT-23-5
packages
PD(MAX) = (125
°C − 25°C) / 333 = 0.300 W for SC-70-5
packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal resistance
θJA. For RT9013 packages, the Figure 2 of derating curves
allows the designer to see the effect of rising ambient
temperature on the maximum power allowed.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0
12.5 25 37.5 50 62.5 75 87.5 100 113 125
Ambient Temperature (
°C)
Single Layer PCB
WDFN-6L 2x2
SOT-23-5
SC-70-5


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