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RT9010-2HPJ6 Datasheet(PDF) 9 Page - Richtek Technology Corporation |
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RT9010-2HPJ6 Datasheet(HTML) 9 Page - Richtek Technology Corporation |
9 / 10 page RT9010 9 DS9010-03 August 2007 www.richtek.com Figure 3. Derating Curves for RT9010 Packages 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0 25 50 75 100 125 Ambient Temperature (°C) TSOT-23-6 For recommended operating conditions specification of RT9010, where TJ(MAX) is the maximum junction temperature of the die (125 °C) and TA is the operated ambient temperature. The junction to ambient thermal resistance ( θJA is layout dependent) for TSOT-23-6 package is 220 °C/W on the standard JEDEC 51-3 single-layer thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by following formula : PD(MAX) = ( 125 °C - 25°C) / (220°C/W) = 0.455 W for TSOT-23-6 packages The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. For RT9010 packages, the Figure 3 of de- rating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. |
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