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STPS2L40UF Datasheet(PDF) 6 Page - STMicroelectronics |
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STPS2L40UF Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 8 page Package Information STPS2L40 6/8 Figure 16. SMB Flat footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 5. SMB Flat dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b(1) 1. Applies to plated leads 1.95 2.20 0.077 0.087 c(1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 L1 0.40 0.016 L2 0.60 0.024 D A L L L1 L2 E E1 b c 1.20 1.20 3.44 5.84 2.07 |
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