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PCB Layout Guidelines:

bq24314

bq24316

SLUS763C – JULY 2007 – REVISED OCTOBER 2007

• This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages.

Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of

PCB traces satisfy the design rules for high voltages.

• The device uses SON packages with a PowerPAD™. For good thermal performance, the PowerPAD should

be thermally coupled with the PCB ground plane. In most applications, this will require a copper pad directly

under the IC. This copper pad should be connected to the ground plane with an array of thermal vias.

• C

close to the IC.

Copyright © 2007, Texas Instruments Incorporated

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Product Folder Link(s): bq24314 bq24316