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FTR-B3GB4.5Z-B10 Datasheet(PDF) 10 Page - Fujitsu Component Limited. |
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FTR-B3GB4.5Z-B10 Datasheet(HTML) 10 Page - Fujitsu Component Limited. |
10 / 11 page 10 Ftr-B3 series roHs Compliance and Lead Free relay Information Reflow Solder condtion 3. Moisture sensitivity l Moisture Sensitivity Level standard is not applicable to electromechanical realys. 4. tin Whisker l SnAgCu and SnCuNi solder is known as low risk of tin whisker. No considerable length whisker was found by our in-house test. We highly recommend that you confirm your actual solder conditions Flow Solder condtion: Pre-heating: maximum 120˚C Soldering: dip within 5 sec. at 260˚C soler bath Solder by Soldering Iron: Soldering Iron Temperature: maximum 360˚C Duration: maximum 3 sec. 1. General Information l Relays produced after the specific date code that is indicated on each data sheet are lead-free now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info. (http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf) l Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward Sn-3.0CU-Ni will be used for the FTR-B3 and FTR-B4 series relays. l All signal and most power relays also comply with RoHS. Please refer to individual data sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE). l It has been verified that using lead-free relays in leaded assembly process will not cause any problems (compatible). l “LF” is marked on each outer and inner carton. (No marking on individual relays). l To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office. l We will ship leaded relays as long as the leaded relay inventory exists. Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC) 2. Recommended Lead Free Solder Profile l Recommended solder paste Sn-3.0Ag-0.5Cu amd Sm-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005. max. 120 sec. 90~120 sec. 20~30 sec. (duration) Cooling Pre-heating Soldering PeakTemp.: max. 250°C 250 220 130 170 |
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