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OPA2674IDRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA2674IDRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 33 page OPA2674 SBOS270A − AUGUST 2003 − REVISED MAY 2006 www.ti.com 2 PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE−LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY OPA2674 SO-8 D −40 °C to +85°C OPA2674ID OPA2674ID Rails, 100 ″ ″ ″ ″ ″ OPA2674IDR Tape and Reel, 2500 OPA2674 SO-14 D −40 °C to +85°C OPA2674I-14D OPA2674I -14D Rails, 58 ″ ″ ″ ″ ″ OPA2674I-14DR Tape and Reel, 2500 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS(1) Power Supply ±6.5VDC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Power Dissipation See Thermal Analysis . . . . . . . . . . . . . . Differential Input Voltage ±1.2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Common-Mode Voltage Range ±VS . . . . . . . . . . . . . . . . . . . . Storage Temperature Range: D, -14D −40 °C to +125°C . . . . . . . . . . . Lead Temperature (soldering, 10s) +300 °C . . . . . . . . . . . . . . . . . . . . . Junction Temperature (TJ) +150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD Rating Human Body Model (HBM)(2) 2000V . . . . . . . . . . . . . . . . . . . . . . Charge Device Model (CDM) 1000V . . . . . . . . . . . . . . . . . . . . . . Machine Model (MM) 100V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Pins 2 and 6 on SO-8 package, and pins 1 and 7 on SO-14 package > 500V HBM. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PIN CONFIGURATIONS Top View SO-8 Top View SO-14 NC = No Connection 1 2 3 4 8 7 6 5 +V S Out B −In B +In B OPA2674ID Out A −In A +In A −V S 1 2 3 4 5 6 7 14 13 12 11 10 9 8 −In A +In A A0 −V S A1 +In B −In B Out A NC NC +V S NC NC Out B Power Control OPA2674I−14D |
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