Model RFP-100200N4Z50-2

Typical Performance

2

Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121

Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369

Power Derating

Suggested Mounting Procedures

FILLED VIA

SOLDER

HEATSINK

PC BOARD

PASTE

SOLDER

SCREW

(2 PLS.)

P.C.B. SOLDER INTERFACE TEMPERATURE —

°C

125

100

75

50

25

100

75

25

50

0

Available on Tape and Reel for Pick and Place Manufacturing.

1. Solder part in place using 60/40 type solder with controlled

temperature iron (700°F).

2. Drill thermal vias through PCB and fill with solder, such as

60/40 type.

3. To ensure good thermal connectivity to heat sink, drill and

tap heatsink and mount PCB board to heat sink using

screws.